Intelligent Wafer Thickness Measurement System

Model: 5AT3

Booth No: L701

Characteristic

Intelligent Wafer Thickness Measurement System
For semiconductor wafer grinding, thinning process or chemical vapor deposition (CVD), epitaxy, and film forming process, there will be a need for thickness monitoring； it also provides accurate measurement of wafer bow, warpage or thickness uniformity generated during the analysis process.

Using a non-contact capacitive displacement sensor module or a white light conjugate foci displacement module, together with a high-precision displacement platform for full-plane scanning, the multi-point wafer thickness real-time measurement data can be obtained within a few seconds.

In addition, an optional wafer diameter measurement module can measure the wafer size accurately and quickly by using optical contour image processing technology. The system can also integrate four-point probes to measure surface resistivity and P/N TYPE to achieve multi-function measurement in one machine. The built-in point path of the software includes 5, 9, 37 points and a custom point path to achieve multi-point measurement information of the wafer; the system can also read the Wafer ID information of the wafer. It is equipped with square porous ceramic vacuum suction cups and positioning fixtures, which are suitable for various shapes of objects to be sided, and are compatible with 2”4”5”6”8”12” wafer measurement.